WIJAYA, Dewi; SAFITRI, Apdila; ANJANI, Fandini Meilia; ARDIANSYAH, Ardiansyah. Complete Wafer Physical Quality Test Based On Mung Bean Sprout Husk Waste. Journal of Agriprecision & Social Impact, [S. l.], v. 2, n. 3, 2025. DOI: 10.62793/japsi.v2i3.81. Disponível em: https://journal.kdp.co.id/index.php/japsi/article/view/81. Acesso em: 22 jan. 2026.